BGA
Lens

Manufacturing Capability

  • Automated SMT placement
  • Placement accurate to 1mil
  • 0402 components
  • 15mil pitch capable
  • Large boards 12" x 12"
  • Fine pitch placement including FQFP and BGA packages
  • Two-sided component placement
  • Cut tape, tube, reels
  • Thru-hole assembly
  • Leaded or lead-free
  • Operational testing
Design and Engineering
  • Firmware development and programming
  • Schematic design
  • PCB layout
  • Concept development
  • Engineering consultation
Service
  • Prototyping
  • Full and partial turn-key
  • Supplied kit assembly
  • Product line development
  • Licensing and certification
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